CIRCUITS INTEGRATED HELLAS
Field of expertise
Description of your activity
European fabless semiconductor company developing RF/mmWave ICs, beamforming solutions and highly integrated phased-array modules for satellite communications and space applications.
Technical domains and services RF/mmWave IC design; Ka-/Ku-band beamforming ICs; Si/SiGe, GaAs and GaN design; phased arrays; antenna-in-package (AiP); system-in-package (SiP); 3D heterogeneous integration; RF module design; prototyping, characterization and production test.
Activity domains Satellite communications; RF & microwave electronics; semiconductor technologies; active antennas and phased arrays; telecom payloads and terminals.
Applications LEO/MEO/GEO satellite communications; flat-panel user terminals; electronically steered antennas; satellite payloads; gateways; airborne, maritime and land-mobile connectivity.
Technical domains and services
Activity domains
- Telecommunications
- Generic Technology and Techniques
- Other
Applications
- Applications
- Aviation
- Energy
- Infrastructure & Smart Cities
- Maritime & Aquatic
- Transport & Logistics
- Other
Your innovative projects
KYTHRION™ – proprietary 3D heterogeneous-integration platform combining Si and III-V technologies for compact, power-efficient Ka-band phased arrays. Kythrion-1U targets a highly integrated Ka-band Tx/Rx electronically steered antenna for space and ground terminals.
CI-ONE™ – Ka-band integrated PA + SPDT switch module family in GaAs pHEMT technology, enabling smaller, more efficient and cost-optimized Satcom RF front ends for terminals, payloads and mobility applications.
Wireless Power Transfer / SWIPT – development of RF/mmWave technologies for wireless power transfer and simultaneous wireless information and power transfer, targeting future integrated connectivity and power-delivery applications.
I AM SEEKING FOR
Technical domains and services
More information about my needs
Seeking partners for advanced RF/mmWave measurements, high-frequency PCB fabrication/assembly, and advanced 3D packaging / heterogeneous integration, including AiP/SiP solutions for Ka-band applications and beyond.
Funding needs
If you are looking for funding, please complete the section below.
I am seeking funding for products with "Technology Readiness Level"
- TRL 6
Funding round sought
- Early stage (Seed)
- Start-up stage (Series A)
Country of registration
- Greece
- United Kingdom
Investment offer
If you are looking into making an investment, please complete the section below.