Auerhammer Metallwerk Gmbh

  • Auerhammer Metallwerk Gmbh

Key information

  • Category : Large company
  • Adress : Hammerplatz 1
  • Zip Code : 08280
  • City : Aue-Bad Schlema
  • Country : GERMANY

Participant

RS avatar

Rajko SCHMIDTCHEN

Sales Manager

Your brochure / catalogue

Field of expertise

Description of your activity

Auerhammer Metallwerk GmbH develops and manufactures high-precision cold-rolled metal strips and foils for demanding technical applications. Our portfolio includes nickel and nickel alloys, soft-magnetic materials, thermal bimetals, clad metals, stainless steel, titanium and copper. We support customers with tailored materials for sensors, electronics, thermal management, electromagnetic shielding and other high-performance aerospace applications.

Technical domains and services

TECHNOLOGY
  • Space Systems Electrical Power
  • Power Electronics
  • Power Generation Technologies
  • Energy Storage Technologies
  • Power Conditioning and Distribution
  • Electromagnetic Technologies and Techniques
  • Wave Interaction and Propagation
  • EMC/RFC and ESD
  • Optics
  • Optical Components Technology and Materials
  • Optical Equipment and Instrument Technology
  • Structures
  • High Stability and High-Precision Structures
  • Advanced Structural Concepts and Materials
  • Thermal
  • Heat Transport Technology
  • Thermal Protection
  • Electrical, Electronic and Electro-mechanical Components
  • EEE Component Technologies
  • Materials and Manufacturing Processes
  • Novel Materials and Materials Technology
  • Materials Processes
  • Material and Process Obsolescence
  • Materials for Electronic Assembly
  • Advanced Manufacturing Technologies

Activity domains

  • Science
  • Generic Technology and Techniques
  • Other

Applications

  • Applications
  • Aviation
  • Energy
  • Environment, Wildlife & Natural Resources
  • Health
  • Infrastructure & Smart Cities
  • Maritime & Aquatic
  • Media, Culture & Sport
  • Safety & Security
  • Transport & Logistics
  • Other

Your innovative projects

Hermetic sealing and expansion alloys for housings of relays or optical systems for spacecraft

Manufacturing of ultrathin metal foil (down to 2 microns thickness) for EMC-applications.

Experience in the production of plated EMC structures for cost-effective use of materials.

I AM SEEKING FOR

Technical domains and services

TECHNOLOGY
  • Space Systems Electrical Power
  • Power Electronics
  • Power Generation Technologies
  • Energy Storage Technologies
  • Power Conditioning and Distribution
  • Electromagnetic Technologies and Techniques
  • Antennas
  • Wave Interaction and Propagation
  • EMC/RFC and ESD
  • Optics
  • Optical Components Technology and Materials
  • Optical Equipment and Instrument Technology
  • Optoelectronics
  • Laser Technologies
  • Detector Technologies
  • Structures
  • High Stability and High-Precision Structures
  • Hot Structures
  • Active/Adaptive Structures
  • Launchers, Reentry Vehicles, Planetary Vehicles
  • Advanced Structural Concepts and Materials
  • Thermal
  • Heat Transport Technology
  • Thermal Protection
  • Heat Storage and Rejection
  • Electrical, Electronic and Electro-mechanical Components
  • EEE Component Technologies
  • Materials and Manufacturing Processes
  • Novel Materials and Materials Technology
  • Materials Processes
  • Cleanliness and Sterilisation
  • Ground and Space Environmental Effects
  • Modelling of Materials Behaviour and Properties
  • Non-Destructive Inspection
  • Material and Process Obsolescence
  • Materials for Electronic Assembly
  • Advanced Manufacturing Technologies
  • Reliability and Reusability Aspects of Materials

More information about my needs

Applications for clad material composites in aerospace, e.g., propulsion technology

Partner for battery development for mobile, independent power supplies

Partner for the development of EMC-applications in aerospace

Funding needs

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I am seeking funding for products with "Technology Readiness Level"

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Funding round sought

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Investment offer

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I am seeking to fund products with "Technology Readiness Level"

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